TSM – Vacuum Reflow
The TRV series offers the outstanding productivity and safety operation of equipment. Particularly , the Compact Vacuum Chamber and Conveyor are technically proved solutions in the field through a technical partnership with ETC.
Key Features
- Completely sealable TSM’s vacuum Reflow, dedicated compression chamber
- Transfer System without jamming PCB (technical partnership with ETC)
- Prevent PCB Drop by minimizing the gab between in/outlet entrance of conveyor in vacuum chamber
- Strengthen durability without conveyor driven roller in high temperature section
- Able to correspond with minimized vacuum chamber with embedded vacuum pump
- Reduce time of vacuuming and easily control vacuum
Available Models
Key Features
- Dramatically reduction of Solder Void
- IPCB transferring system
- Eco-friendly ultra low power consumption and high thermal insulation specification
- Standard option for high efficiency and collection system of large quantity Flux
- Heating method of up/down hot air circulation
Key Features
- Independent Twin Vacuum Reflow as the World Premier (2X Vacuum Chamber + 2X Oven + 2X PC independent operation)
- Doubled productivity compared to Single Reflow
- Completely vacuumable dedicated compression chamber of TSM’s vacuum Reflow
- Transport System without jamming PCB (ETC Technical Partnership)
- Minimize the gab of in/out conveyor to prevent PCB Drop
- Enhanced durability with none conveyor driven roller in high temperature sections
Key Industries
- Semiconductor, Solar & Electronics
Brand
TSM has been produced for Reflow Oven and Nitrogen generator with a representative model, Full Auto Soldering Machine since the company’s foundation in 1990.
