AccuEye™ is a machine vision system designed for through hole component inspection. The design of the system is radically different from the traditional Surface Mount Technology (SMT) inspection machine.

AccuEye™ is not data driven but uses images of a known good board to compare with the incoming production boards. The idea is very similar to optical comparator and hence the name Automatic Comparative Inspection machine (ACI). The ACI is particularly suitable for through hole components inspection because of the diverse component geometry of the through hole components. While it is not data driven, it retains some of the attributes of a surface mount inspection machine such as image offset compensation using fudicials.

Key Features

• Top/Bottom Inspection in one pass
• Wide Field of View for large Components
• Conveyor inlet Height and Optics  to handle tall components up to 90mm
• Available Heavy Duty Chain Conveyor
• Fast Automatic Comparative Inspection Algorithm
• Ease of Programming with Offline Programming capabilities

AccuID™ is a SMT component reel barcode label reader. The system is a bench top unit that can read multiple barcodes in any orientation all in one frame. Base on the user defined prefix of each barcode or a script to parse any 2D barcode label, the system sorts the barcode into entities such as Part Number, Date Code, Lot Code and Quantity. User can also print barcode labels from the application.

The system come with basic function to output entities as a sequence of keystroke into users’ existing applications. For more complicated applications, a user interface is offered to allow maximum flexibility to write to custom data base or to interface with MES and ERP systems.

AccuID™ is perfect for creating unique ID (license plate) label for placement equipment component verificaiton system and incoming label verification to minimize wrong label being applied onto reels of SMT component.

Key Features

• Handle Full Range of Reel Size and Thickness
• Flexible Software Interface

AccuLiFT™ is an automatic reel storage system using the traditional Vertical Lift Module (VLM) design concept to achieve high storage capacity while minimize machine foot print. A person is no longer required to manually feed the reel storage system one at a time or manually load reel pallet one reel at a time. All the users need to do is to stack 30-100 reels onto multiple stacking units and the robotic arm will pick up the reels from the stackers and place them into the storage system. The storage system is designed with a double pallets in/out buffer for loading and unloading so while the robot is working on one pallet, the extractor will store and retrieve parts for the next pallet.

Maximum storage capacity of 8,300 reels of SMT component reels represents the highest density in component storage system today. Automatic barcode reader identifies each reel before it is put away into the system to maintain accurate inventory. Also included are Barcode label applicator on output side and Flexible software for MES integration. Users can drastically reduce component kitting time and still maintain inventory accuracy.

Key Features

• Fully Automatic
• Very High Storage Density with Very Small Foot Print
• Easy Reel Size and Thickness Re-configuration by user
• Reel output sorting built into the system
• Modular Design for easy transportation
• No Calibration Direct Drive System design(patent pending)

The cushions are the main protection placed inside the wafer carriers and absorbing external chocks and internal moves of the wafers stack. They are compatible with 4“, 5“, 6“, 8“ and 12“ wafers, and exist with different thicknesses: 3mm, 5mm and 6mm.

Their multi-layer structure improves their mechanical performances and offers a high purity grade. One thick PE core is covered with PE films on both sides.

The spacers are the interleaves placed in between the wafers for protecting the sides from scratches and particle contamination. They are made with very high pure materials offering extreme performances against the particle contamination and the outgassing risks. All the models have embossed shape and are compatible with 4“, 5“, 6“, 8“ and 12“ wafers and framed-wafers.

Anti Statics PE: 350µm thick, Surface resistivity <1*10E+12 Ω

Conductive PE: 250µm thick, Surface resistivity <1*10E+9 Ω

Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines:

– Protos Carrier MA series Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.

– Protos Carrier ND series Carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.

ADT dicing blades are high-quality cutting tools designed for precise and clean cutting of hard and brittle materials, such as ceramics, glass, and semiconductors. Since it is made of diamond or cubic boron nitride, these blades offer excellent durability and are available in various shapes and sizes to accommodate different cutting applications. ADT dicing Blades provide efficient and reliable cutting performance which is ideal for use in the semiconductor industry and electronic component production.

Key Features

• Designed for cutting hard and brittle materials
• Minimizes chipping and cracking
• Long-lasting performance

ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.

 

Key Features

• Used for dicing wafers and substrates into smaller chips
• High accuracy and low kerf loss for optimal yield
• Compatible with a wide range of materials and thicknesses
• Robust and durable design for long-term use
• Offers advanced automated blade height adjustment and real-time monitoring.

Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.

Key Features 

• New User Interface (NUI) Upgrade Kit
• Dicing Floor Management (DFM)
• Height Measurement Tool (HMT)
• Dressing Procedure

Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM’s low drossing solder bar alloys provide a high purity product exceeding IPC, JEDEC and IEC requirements.

AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.

Key Features

• Low Oxide Content
• Reduces Defects Such as Bridging and Icicling
•  Lower Surface Tension than Competitive Brands
• Available in Extruded, Cast, and Margash Bars
• Produced from High Purity Virgin Metals

AIM’s wide selection of fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

Key Features

• Available in VOC-Free and Alcohol Based
• Lead-Free and Tin/Lead Compatible
• Can Be Brushed, Dispensed, Pin Transferred or Stencil Printed
• For Wave, Selective and Rework Soldering

AIM Solder provides high quality alloys and complimentary materials to the electronics industry. AIM’s variety of solder alloys provide solutions for issues commonly found within the SMT assembly industry. AIM products are produced using AIM’s proprietary ElectropureTM process that produce a low drossing and low oxide alloy. AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

Key Features

• Tin-silver-copper alloy in line with JEIDA recommendation
• Gold die-attach alloy
• Standard electronic assembly alloy prior to RoHS

AIM’s complete line of solder paste has been developed to deliver robust performance, ease of use and cost effectiveness. AIM solder pastes resolve difficult issues including QFN voiding, low area ratio printing, and high reliability requirements for consumer, LED, automotive, aerospace and military applications.

AIM solder paste is available in no clean, water soluble, and RMA formulations with a wide variety of alloy offerings including AIM’s proven REL alloys, SAC, SN100C® and lead-based solders. AIM’s alloy and flux combinations provide high quality performance for a wide variety of SMT applications. In addition to SAC based SMT paste, AIM offers low temperature solder paste and jetting solder paste.

Key Features

• Lead-Free and Tin/Lead Compatible
• Halogen- and Halide-Free
• Excellent Wetting
• No Head-in-Pillow
• Low Tombstoning
• Clear Pin-Probe Testable Residue
• Extended Stencil Life and Tack Tim

AIM’s complete line of solid and cored solder wire is available in a wide selection of alloys including AIM’s innovative REL alloys, lead-free and leaded solder alloys. AIM’s cored solder wire is available with no clean, water soluble and rosin flux chemistries. The combination of available alloys and novel flux chemistries offer superior soldering performance across a variety of applications, making AIM the industry’s premier solder wire manufacturer. AIM solder wire is REACH and RoHS compliant and tested to meet or exceed IPC J-STD-006 and J-STD-001 requirements.

AIM’s proprietary production methods ensure a void-free wire and consistent performance. AIM’s hand and robotic solder wires have been engineered for powerful wetting, fast thermal transfer, and high reliability across a wide range of through-hole and SMT applications. AIM solder wire is suitable for all electronic applications including consumer, automotive, LED, military and medical industries.

Key Features

• Solid and Cored Wire Available
• Lead-Free and Tin/Lead Compatible
• Excellent Wetting and Solderability
• Good Thermal Transfer

With an ever-increasing emphasis on accountability, AMADA WELD TECH’s WM-100A is the most advanced resistance welding monitoring system available from any manufacturer. Built in the USA, the WM-100A offers more of the information you need for resistance welding process development, production monitoring and data to support your ISO, and GMP and TQM requirements. Not only will it monitor what happens during the weld, but also before it is triggered, giving you a true 360-degree view of your welding process.