Nordson Electronics Solutions – Plasma Systems – Sphere Series


    Damien Teo, General Manager, Semiconductor & Electronics, DKSH Technology China

    DKSH (Shanghai) Ltd.
    Unit 502, No.13 Xin’an Building, 99 Tianzhou Road
    200233 Shanghai

    +86 21 6482 3806

    +86 21 3367 8466



    Tay Tun Yong, Technical Sales & Services Manager

    DKSH Technology Sdn. Bhd.
    No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
    11900 Bayan Lepas, Penang

    +60 4 645 2672



    Monica Wan, General Manager

    DKSH Singapore Pte Ltd
    625 Lorong 4 Toa Payoh, #03-00
    319519 Singapore

    +65 6962 3121

    +65 6273 1503



    Lau Chek Chung, General Manager, Semiconductor & Electronics, Malaysia, Thailand and Vietnam

    DKSH (Thailand) Limited
    2106 Fantree 4 Building, Sukhumvit Road,
    Phrakhanong-Tai, Phrakhanong 10260 Bangkok

    +66 2 639 7000



    Ly Thi Bich Duyen (Bella), Senior Supervisor

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City

    +84 8 38125806



    Nguyen Phan Loan Anh, Assistant Sales Manager

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City

    +84 8 38125806


  • MesoSPHERE™ Plasma System Brochure

  • StratoSPHERE™ Plasma System Brochure

SPHERE series systems support automated handling and processing of round or square wafer/substrate sizes ranging from 75mm to 300mm. In addition, thin wafer processing with or without carriers is possible, depending upon wafer thickness.

The patented plasma chamber design provides exceptional etch uniformity and process repeatability. Primary plasma applications include a variety of etching, ashing, and descum steps. Other plasma processes include contamination removal, surface roughening, increasing wettability, and enhancing bonding and adhesion strength, photoresist/polymer stripping, dielectric etch, wafer bumping, organic contamination removal, and wafer destress.

  • Wafer Cleaning – The SPHERE series plasma systems remove contamination prior to wafer bumping, remove organic contamination, remove fluorine and other halogen contamination, and remove metal and metal oxides. Plasma also improves spun-on film adhesion and cleans metallic bond pads.
  • Wafer Etching – Plasma systems descum wafer of residual photoresist and BCB, pattern dielectric layers for redistribution, strip/etch photoresist, enhance adhesion of wafer applied materials, remove excess wafer applied mold /epoxy, enhance adhesion of gold solder bumps, destress wafer to reduce breakage, improve spun-on film adhesion, and clean aluminum bond pads.

Technical Specifications

W x D x H – Footprint1405W x 26150 x 1742H mm (55W x 103D x 69H in)Single Chamber werem: 1480W x 2700D x2180H mm (58W x 108D x 88H in)
Dual Chamber werem: 1480W x 2700D x2180H mm (58W x 106D x 88H in)
Quad Chamber w/ EFEM: 2695W x2700D x2190H mm (108W x106D x88H in)
Net Weight: Process Module
480 kg (1058 Ibs)
640 kg (1411 Ibs)
725 kg (1600 Ibs)
880 kg (1800 Ibs)
Maximum Volume5.5 liters (338 in³)11.7 liters (715 in³)
Variable Electrode ConfigurationsPower-Ground, Ground-Power, Power-PowerPower-Ground, Ground-Power, Power-Power
Gas GeneratorsNitrogen, Hydrogen (Requires Additional Non-Optional Hardware)Nitrogen, Hydrogen (Requires Additional Non-Optional Hardware)
FacilitiesChiller, ScrubberChiller, Scrubber
For further details, please refer to enclosed brochure.

Key Industries

  • Semiconductor, Solar & Electronics

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