Nordson Electronics Solutions – Automated Plasma Treatment System – FlexTRAK® SHS

  • CHINA

    Damien Teo, General Manager, Semiconductor & Electronics, DKSH Technology China

    DKSH (Shanghai) Ltd.
    Unit 502, No.13 Xin’an Building, 99 Tianzhou Road
    200233 Shanghai
    China

    +86 21 6482 3806

    +86 21 3367 8466

    Email

  • MALAYSIA

    Tay Tun Yong, Technical Sales & Services Manager

    DKSH Technology Sdn. Bhd.
    No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
    11900 Bayan Lepas, Penang
    Malaysia

    +60 4 645 2672

    Email

  • SINGAPORE

    Monica Wan, General Manager

    DKSH Singapore Pte Ltd
    625 Lorong 4 Toa Payoh, #03-00
    319519 Singapore
    Singapore

    +65 6962 3121

    +65 6273 1503

    Email

  • THAILAND

    Lau Chek Chung, General Manager, Semiconductor & Electronics, Malaysia, Thailand and Vietnam

    DKSH (Thailand) Limited
    2106 Fantree 4 Building, Sukhumvit Road,
    Phrakhanong-Tai, Phrakhanong 10260 Bangkok
    Thailand

    +66 2 639 7000

    Email

  • VIETNAM

    Ly Thi Bich Duyen (Bella), Senior Supervisor

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • VIETNAM

    Nguyen Phan Loan Anh, Assistant Sales Manager

    DKSH Technology Co.,Ltd
    5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
    70000 Ho Chi Minh City
    Vietnam

    +84 8 38125806

    Email

  • FlexTRAK® SHS Brochure


Industry-Leading Throughput and Reliability



Built upon Nordson Electronics Solutions’ patented plasma technology, the FlexTRAK®-SHS is our latest fully automated plasma system incorporating a high-capacity F3-S chamber, to provide high uniformity and increased productivity. The chamber architecture remains the same as the smaller FlexTRAK platform, providing a seamless transition between chambers as production demands more capacity.

Key Applications



  • Pre-wire bond plasma treatment on semiconductor package substrates and lead frames
  • Pre-underfill plasma treatment on flip chip packages
  • Pre-mold plasma treatment on semiconductor package substrates and lead frames
  • Plasma treatment of semiconductor package substrates and lead frames for improved adhesion
  • Removal/reduction of oxidation on lead frame
  • Technical Specifications

    W x D x H – Footprint2314 x 1935 x 1787 mm (2293 H mm with light tower)
    91.1 x 76.2 x 70.5 in (90.3 H in with light tower)
    Net Weight1305 kg (2,871 lbs)
    Chamber VolumeF3-S chamber: 9.6 liters (585 in³)
    F3 chamber: 5.5 liters (338 in³)
    Powered Electrode Dimensions W x DF3-S chamber: 305 x 610 mm (12 x 24 in)
    F3 chamber: 305 x 305 mm (12 x 12 in)
    RF Power: Standard WattageF3-S chamber: 1000 W
    F3 chamber: 600 W
    RF Power: Frequency13.56 MHz
    Gas Control: Maximum Number of MFCs4
    For further details, please refer to enclosed brochure.

    Key Features

    FlexTRAK® SHS

    Industry-Leading Throughput

    • Large capacity F3-S process chamber
    • Simultaneous strip buffering and processing
    • Advanced automation and magazine splitting capabilities

    New Product Development

    • Advanced material handling
    • Ability to accommodate increasingly larger strip sizes
    • Sophisticated jam detection

    Application Flexibility

    • Plasma chamber effectiveness
    • Configurable process chamber
    • Versatile treatment modes

    Key Industries

    • Semiconductor, Solar & Electronics

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