HANMI – TC Bonder
TC Bonders bond individual chips on processed wafers, are in increasing demand driven by the introduction of high-bandwidth memory (HBM) and DDR5.
Description
Super iron casting helps maximize degree of precision and durability with minimizes vibration.
Key Features
- High productivity
- High accuracy
Available Models
Key Features
- High productivity
- Film assist bonding
- Multi layer die stack
- Contamination inspection
- TSV 3D stack bonding
- Optimized thermal & force profiling
- 2μm@3σ accuracy
- Auto scanning function
- Small footprint
- TCNCP dispensing
Key Features
- High productivity
- Film assist bonding
- Multi layer die stack
- Contamination inspection
- TSV 3D stack bonding
- Optimized thermal & force profiling
- 2μm@3σ accuracy
- Auto scanning function
- Small footprint
- TCNCP
Key Features
- Low force bonding
- Quadruple (4x) productivity
- Auto scanning function
- 1.5μm@3σ accuracy (option)
- Small footprint
- Optimized thermal & force profiling
- 4 bonding heads
- Contamination inspection
- TSV 3D stack bonding
Key Features
- Low force bonding
- Quadruple (4x) productivity
- Auto scanning function
- 1.5μm@3σ accuracy (option)
- Small footprint
- Optimized thermal & force profiling
- 4 bonding heads
- Contamination inspection
- TSV 3D stack bonding
Additional information
| Markets | Singapore |
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