AIM – Bar Solder
Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in a variety of wave soldering defects such as bridging, projections, and poor wetting. To avoid these issues, AIM’s low drossing solder bar alloys provide a high purity product exceeding IPC, JEDEC and IEC requirements.
AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.
Key Features
- Low Oxide Content
- Reduces Defects Such as Bridging and Icicling
- Lower Surface Tension than Competitive Brands
- Available in Extruded, Cast, and Margash Bars
- Produced from High Purity Virgin Metals
Available Models
Low-silver, Low-cost Alternative for SAC305 With Drop-In Performance
AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance.
Key Features
- Reduces Tin Whisker Formation
- Enhanced Reliability Versus SAC and Low/No-Silver Alloys
- Low Cost SAC Alloy
- Improved Thermal Cycling Performance
- Improved Wetting Versus All Low/No-Silver Alloys
AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and high g-forces are a concern.
Key Features
- Enhanced Durability for Use in Extremely Harsh Environments
- Reliability Equal to Sn/Ag/Bi/Sb/Ni/Cu Alloys with Wider Assembly Process Window
- Mitigates Tin Whisker Formation
- Creep Rates Lower Than SAC Alloys
- Improved Thermal Cycling Performance
- Improved Wetting Versus All Low/No-Silver Alloys
The Industry Standard – High purity, low dross, suited for all soldering applications
SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.
Key Features
- Lowest Cost Sn/Ag/Cu Alloy
- Excellent Fatigue Resistance
- Compatible with all Flux Types
- Excellent Solder Joint Reliability
- Best Wetting Sn/Ag/Cu Alloy
The Original Silver-Free SAC305
SN100C is a lead-free solder alloy that is comprised of tin-copper-nickel + germanium. The properties of SN100C offer an advantage in terms of performance and cost compared to other lead-free alloys. From automotive and aerospace to consumer and telecom, SN100C has a proven history of providing a reliable, cost-effective lead-free alloy solution.
Key Features
- Smooth, Bright Solder Joints
- Bridge-Free Soldering
- Low Cost – Does Not Contain Silver
- Reduced Copper Erosion from Holes, Pads and Tacks
- Dross Rate Similar to Tin-Lead Alloys
- Complies with IPC J-STD-006
High Purity and Reduces Drossing
Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.
Key Features
- High Purity
- Reduces Drossing
- Exceeds IPC-J-STD-006 Specifications
AIM Electropure Reduces Dross Better Than Competitors
Dross Comparison of AIM Electropure Bar vs. Competitors
500 pounds of each type of alloy was heated in a wave solder pot at 500°F for 6 hours. The pot was de-drossed every 3 hours. After 6 hours the amount of dross generated from each type of solder was weighed. AIM’s bar solder has proven to reduce drossing as compared to competitive brands.
News
AIM’s REL22™ Awarded Circuits Assembly’s NPI Award 2018
Cranston, Rhode Island USA – AIM, a leading global manufacturer of solder assembly materials for the electronics industry, announces that their REL22™ high reliability solder alloy was awarded Circuits Assembly’s New Product Introduction (NPI) Award 2018 at IPC Apex at the San Diego Convention Center.
Selected by an independent panel of industry experts, the Circuits Assembly NPI award winner is selected based on creativity & innovation, compatibility with existing technology, cost effectiveness, expected reliability, performance, and more.
AIM’s REL22 lead-free solder alloy is specifically engineered as an exceptionally durable alloy for extreme service environments and provides superior thermal cycling performance and lower voids versus other lead-free alloys. It has been shown to reduce tin whisker formation and improved strength versus SAC alloys making them ideal for high reliability electronics applications.
Q&A Sessions – Deep Dive Into the Alloys
High Reliability Alloys and REL22
Discussion about the benefits of using alternative alloys such as REL22™ over SAC305 for high reliability applications. Featuring Tim O’Neill, AIM’s Director of Product Management and Jen Fijalkowski, AIM’s Technical Marketing Engineer.
SAC305 and Alternative Alloys
Tim O’Neill, AIM’s Director of Product Management, discusses the advantages and disadvantages of SAC305 and alternative alloys.
Key Industries
- Semiconductor, Solar & Electronics
Brand
AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry, catering to various specialized businesses such as LED lighting, mobile devices, automotive, renewable energy, and aerospace. Their advanced line of solder assembly materials includes a wide variety of halogen-free, tin-lead and lead-free solder, including solder paste, liquid flux, cored wire, bar solder and more, on a global scale. AIM has expanded into over a dozen support and manufacturing facilities worldwide, recognizing the need to provide dedicated local support while keeping a global perspective. AIM is committed to developing world-class products through innovative R&D and offers unparalleled sales and technical support, with a dedicated team of engineering professionals available around-the-clock to assist customers in reaching their manufacturing goals.