ADT – Dicing Saw
Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.
The ADT dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes ranging from small pieces to 300 mm diameter wafers.
Key Features
- New User Interface (NUI) Upgrade Kit
- Dicing Floor Management (DFM)
- Height Measurement Tool (HMT)
- Dressing Procedure
Available Models
ADT Dicing Saws
Key Industries
- Semiconductor, Solar & Electronics
Brand
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.