ADT – Dicing Saw
Our ADT dicing saw is a state-of-the-art saw that is fully programmable and controlled by a microprocessor. It is designed for cutting wafer-thin materials into smaller component pieces, with a specific focus on silicon wafers. However, by using the appropriate configuration and blade type, it is capable of cutting any thin material.
The ADT dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes ranging from small pieces to 300 mm diameter wafers.
Key Features
- New User Interface (NUI) Upgrade Kit
- Dicing Floor Management (DFM)
- Height Measurement Tool (HMT)
- Dressing Procedure
Available Models
Technical Spcifications
| Specifications | 8030 |
|---|---|
| Workpiece Size | Ø 8”, Ø 12″ or 12″ × 12″ Square |
| Blade Size | 2” – 3” |
| X Axis | Air Slide |
| Cleaning Method | Atomized cleaning capabilities |
| Dimensions (W × D × H) mm | 1,145 × 1,687 × 1,830 1,500 |
ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8030 is a high accuracy system that can dice product up to 12” in diameter or 12” × 12” product, at high performances and low cost of operation.
Key Features
- Flexibility – Supports Hub and Hubless blades up to 3” O.D.
- Spindles of 1.8 kW or 2.2 kW high power
- Bridge type frame supporting efficient wafer processing
Technical Spcifications
| Specifications | 8020 |
|---|---|
| Workpiece Size | Ø 8” |
| Blade Size | 2” – 3” |
| X Axis | Air Slide |
| Cleaning Method | Atomized cleaning capabilities |
| Dimensions (W × D × H) mm | 1,015 × 1,460 × 1,820 1,300 |
ADT 8020 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.
Key Features
- Flexibility – Supports Hub and Hubless blades up to 3” O.D.
- Spindles of 1.8 kW or 2.2 kW high power
- Intuitive operation interface using a large 19” touch screen monitor
Technical Spcifications
| Specifications | 7900 Duo | 7920 Duo | 7930 Duo |
|---|---|---|---|
| Workpiece Size | Ø 8″ | 10″ × 10″ | 12″ × 10″ or Ø 12″ |
| Blade Size | 2” – 3” | 2” – 3” | 2” – 3” |
| X Axis | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 875 × 975 × 1450 | 875 × 975 × 1450 | 875 × 975 × 1450 |
ADT 7900 series has two facing spindles that can simultaneously dice wafers or packages at high throughput. ADT 7900 series is a high accuracy system that can dice product at high performances and low cost of operation.
Key Features
- Simple Blade Change
- SECS/GEM platform ready
- Full access to any area of the system for easy maintenance
Technical Spcifications
| Specifications | 7122 | 7124 | 7132 | 7134 |
|---|---|---|---|---|
| Workpiece Size | Ø 8″ | Ø 8″ | Ø 12″ or 300mm × 300mm W/O frame | Ø 12″ or 300mm × 300mm W/O frame |
| Blade Size | 2” – 3” | 4” – 5” | 2” – 3” | 4” – 5” |
| X Axis | Air Slide | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 965 × 1300 × 1600 | 965 × 1300 × 1600 | 965 × 1300 × 1600 | 965 × 1300 × 1600 |
The 7120 / 7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility to support your needs.
Key Features
- Support 2″-3″ and 4″-5″ blade O.D. with large ‘Z’ stroke
- ‘X’ axis air bearing for smooth motion and super cut quality
- Automation with high resolution optics
Technical Spcifications
| Specifications | 7222 | 7223 | 7224 |
|---|---|---|---|
| Workpiece Size | Ø 8″ | Ø 8″ | Ø 8″ |
| Blade Size | 2” – 3” | 4” – 5” | 2” – 3” |
| X Axis | Air Slide | Air Slide | Air Slide |
| θ Axis, Repeatability | 4 arc-sec | 4 arc-sec | 4 arc-sec |
| Dimensions (W × D × H) mm | 965 × 1460 × 1700 | 965 × 1460 × 1700 | 965 × 1460 × 1700 |
The 7200 system offers a wide range of advanced automation and process monitoring option to meet the throughput and quality requirements of your most challenging dicing applications: silicon, glass on silicon, glass, BGA & QFN packages, LTCC, ceramic, PCB and other hard material applications.
Key Features
- Efficient wafer handling system
- Continuous digital magnifications vision system
- Blade wear prediction algorithm reduces height measurement time and increases UPH
ADT Dicing Saws
Key Industries
- Semiconductor, Solar & Electronics
Brand
Advanced Dicing Technologies (ADT) specializes in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC). ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.